(1) Impact testing applications: In an impact test the solder ball is stronger and more load is transmitted to the bond
(2) Brittle fracture joint failure analysis: Many more brittle fractures occur high test speed than at convention speeds.
(3) Evaluation of new pad finishes and solder: SnPb solder on ENIG plating exhibits more brittle fracture failures than on NiAu or bare Cu pads.
(4) Lead free solder ball joint evaluation: Lead-free solder exhibits more brittle fracture failures when tested at high speed than traditional lead solder.
(1) High Speed & Pull Tester Mainframe - 3 axis motorized X, Y, Z axis - Test motion speed and height is programmable - Data measurement: force and energy results(Pre-Peak, Post Peak energy display), min, max, standard deviation, CPK etc. - Total step back accuracy +/- 1 micron or better - System accuracy +/- 0.25% or better - Test System for high speed solder ball shear shall be designed and fully complied in accordance with JEDEC standard No. 22B117 High Speed Shear-Condition B and JEDEC standard No. 22B115 High Speed Pull-Condition B
(2) High Speed Shear Test up to 3kgf Loadcartridge - Adjustable test speed from 10mm/sec to 4000mm/sec - Force and energy results display - Loadcartridge accuracy +/- 2% FSD or better - Calibration kit
(3) Shear Transducers for 250um~750um Solder ball - 200~750 micron solder ball shear transducer tips
(4) Sample Workholder - Single package work holder for high speed shear test
BGA 등의 전자부품 패키지 및 솔더볼 접합강도 평가시험 중 고속(최대 4m/sec)으로 전단 및 인장 시험하여 그 파단되는 양상, 하중값, 에너지를 확인할 수 있음
뿌리장비 예약
장비 상세정보
| 장비사진 | 장비명 | 초가속 접합평가 시스템(High speed joint test system) | ||
|---|---|---|---|---|
|
제작사 | Dage | 모델명 | 4000HS |
| NTIS | NFEC-2013-06-180089 | E-TUBE | 1304-Z-0010 | |
| 장비분류 | 분석장비 | 기술분야 | 용접 | |
| 보유센터 | 시흥뿌리기술지원센터 | 장비상태 | 정상 | |
| 구축일 | 2013-04-15 | 구축비용 | 89,000,000원 | |
| 수수료 | 57,000원/hr | 바우처 사용 | 사용가능 | |
| 담당자 | 이소정 | 연락처 | ||
| 매뉴얼 |
|
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주요사항
원리 및 특징
칩을 1m/s 이상의 높은 속도로 전단응력을 가하고 전단이 일어나는 강도를 측정
사용예
접합부 취성파괴 및 불량분석
활용분야
(1) High Speed & Pull Tester Mainframe
- 3 axis motorized X, Y, Z axis
- Test motion speed and height is programmable
- Data measurement: force and energy results(Pre-Peak, Post Peak energy display), min, max, standard deviation, CPK etc.
- Total step back accuracy +/- 1 micron or better
- System accuracy +/- 0.25% or better
- Test System for high speed solder ball shear shall be designed and fully complied in accordance with JEDEC standard No. 22B117 High Speed Shear-Condition B and JEDEC standard No. 22B115 High Speed Pull-Condition B
(2) High Speed Shear Test up to 3kgf Loadcartridge
- Adjustable test speed from 10mm/sec to 4000mm/sec
- Force and energy results display
- Loadcartridge accuracy +/- 2% FSD or better
- Calibration kit
(3) Shear Transducers for 250um~750um Solder ball
- 200~750 micron solder ball shear transducer tips
(4) Sample Workholder
- Single package work holder for high speed shear test
- 3 axis motorized X, Y, Z axis
- Test motion speed and height is programmable
- Data measurement: force and energy results(Pre-Peak, Post Peak energy display), min, max, standard deviation, CPK etc.
- Total step back accuracy +/- 1 micron or better
- System accuracy +/- 0.25% or better
- Test System for high speed solder ball shear shall be designed and fully complied in accordance with JEDEC standard No. 22B117 High Speed Shear-Condition B and JEDEC standard No. 22B115 High Speed Pull-Condition B
(2) High Speed Shear Test up to 3kgf Loadcartridge
- Adjustable test speed from 10mm/sec to 4000mm/sec
- Force and energy results display
- Loadcartridge accuracy +/- 2% FSD or better
- Calibration kit
(3) Shear Transducers for 250um~750um Solder ball
- 200~750 micron solder ball shear transducer tips
(4) Sample Workholder
- Single package work holder for high speed shear test